By Swab, Sanjay Mathur, Tatsuki Ohji
The Armor Ceramics Symposium was once held January 25-27, 2010 in
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Acoustic spectroscopy results suggest that the regions of higher attenuation seen in Figure 2 are therefore due to a clustering of smaller heterogeneities rather than from large anomalous inclusions. Figure 3: Acoustic spectroscopy results for three regions in the 1,5μπι grain size spinel single Gaussian curve fitting. Table I: Curve fitting parameters for attenuation coefficient spectra from the 1,5μπι grain size spinel. όμπι grain size spinel sample is shown in Figure 4. Three regions were chosen for this material for more detailed analysis using acoustic spectroscopy, denoted by the numbers 1-3 in Figure 4.
E. at the focal point) was measured at 5mm, which confirms the validity of the experimental set up used for the immersion scanning. At the focal point the ultrasonic energy is at maximum while the beam width is smaller. These focal point characteristics translate to better defect detection and response compared with an unfocused beam. The simulation shown that the -6dB beam width at the focal spot is 1mm. Figure 2. Visualization of the ultrasonic beam propagation (a) in water (b) in material Advances in Ceramic Armor VI ■ 27 NDT Characterization of Boron Carbide for Ballistic Applications Pressing 1 Ultrasonic Results For calibration and technique development purposes, Tile 1 from pressing 1 was machined with a diamond saw, and slots generated at different depths across the tile.
32nd Inter. Conf. & Expos, on Adv. Ceramics and Composites, (2008) 4 Y. Onda, and Y. Mizuta, Nondestructive Evaluation of Porosity in Si3N4 Ceramics by using Ultrasonic method, in Proc. , Vol 7—Ultrasonic Testing, P. Mclntire, Ed. Am Soc. For Nondestructive testing ( 1991) 6 T. A. K. Pillai, W. A. Ellingson, J. G. Sun, T. E. Easier , and A. Szweda, A Correlation of Air-Coupled Ultrasonic and Thermal Diffusivity Data for CFCC Materials, in Ceramic Engr. and Sei. Proc, Vol. 18, Issue 4 (1997). A.
ADVANCES IN CERAMICS ARMOR VI: Ceramic Engineering and Science Proceedings, Volume 31 by Swab, Sanjay Mathur, Tatsuki Ohji